TESA

Adhesive Solution for Packaging Printers

tesa^® Twinlock is a self-adhesive, reusable, and compressible sleeve that can reportedly help packaging printers achieve greater operational efficiency and improve return on investment (ROI) while reducing the solid waste associated with packaging printing. The traditional approach to printing flexible packaging is to employ single-use tape, but this can be time consuming and expensive. It can also result in tons of waste headed to the landfill every year, which represents an increasing concern as consumer packaged goods (CPG) companies strive to meet aggressive 2025 sustainability goals.

Comprising a base sleeve, polyurethane foam, stabilization film, and adhesive polymer, tesa Twinlock eliminates the need for tape in packaging printing. The company reports that the product’s self-adhesive and stabilization layers lead to increased efficiency and improved ROI.

www.tesa.com

BOSTIK

Engineering Adhesives for Electronics Manufacturing 
Bostik, an Arkema company, has extended its Born2Bond™ engineering adhesive range designed to support the electronics manufacturing sector in the assembling, waterproofing, dustproofing, and serviceability of miniaturized electronics such as wearables and handheld devices, as well as larger applications such as smart meters and LED lights. These methoxyethyl cyanoacrylate (MECA) and dual-cure Light Lock adhesives (patented in multiple countries) are already available for electronics OEMs for high-precision instant bonding, encapsulation, and potting applications.

Bostik reports that its new versatile and single-component hot-melt polyurethane reactive (HMPUR) range has been designed specifically for the manufacture of miniaturized handheld and wearable electronic devices such as mobile phones, smart watches, and headphones. High-performance HMPUR products are available with a range of viscosities and open times to suit different applications and assembly processes.

https://born2bond.bostik.com/en/home

VISCO-TEC

High-Precision Adhesive Dosing
ViscoTec recently introduced cartridge applicators featuring Festo pneumatic control modules for the exact and clean feeding of adhesives, pastes, and silicones of different viscosities in applications such as gluing smartphone displays, applying thermal paste, or gluing micro-cameras. The eco-FEED and vipro-FEED DC are the latest devices for automated, even application of double-chamber cartridges.

Minute quantities need to be applied precisely and reproducibly to circuit boards, for example, or gaps need to be precisely filled on different electronic components, often using highly abrasive pastes. The appeal of this new development is that the precision application of the adhesive leaves no rims of adhesive on displays or micro-cameras, as well as no adhesive oozing from the corners and edges on glued components in everyday consumer goods.

www.viscotec-america.com 
www.festo.us 

MASTER BOND

Thermally Conductive, Electrically Nonconductive, Low-Outgassing Epoxy 
Master Bond EP40TC is a two-part epoxy system designed for bonding, sealing, and encapsulating applications where thermal conductivity and electrical insulation are required. With a high thermal conductivity value of 8-11 BTU•in/(ft² •hr•°F) [1.16-1.60 W/(m•K)], it is formulated with a small particle size filler, making it ideal for filling small cavities and applying the product in thin sections.

“EP40TC’s key distinguishing factor is that there is no compromise on the bond strength while providing excellent elongation and toughness,” said Rohit Ramnath, senior product engineer. “It has a high strength profile with a tensile lap shear strength of 2,300-2,500 psi, an elongation of 60-70%, and a tensile modulus of 5,000-15,000 psi. Also, it meets NASA low outgassing specifications which is a prerequisite for many aerospace, electronic, and optical applications.”

www.masterbond.com